Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool
Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool "5m 50m & 100m
Tanaka is the premier manufacturer of bonding wire to the semiconductor industry. Tanaka offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding.
Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. Tanaka brings quality products at the cutting-edge of semiconductor technology.
- Gold Bonding Wire
- Gold Alloy Bonding Wir
- Copper Bonding Wire
- Aluminum Bonding Wire for Power Devices
- Aluminum Bonding Ribbon
- Aluminum-Silicon Bonding Wire
- Silver Alloy Bonding Wire