Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool

£25.00 (exc VAT) (£30.00 inc VAT)

Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool

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Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool "5m 50m & 100m

Tanaka is the premier manufacturer of bonding wire to the semiconductor industry. Tanaka offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding.

Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. Tanaka brings quality products at the cutting-edge of semiconductor technology.

  • Gold Bonding Wire
  • Gold Alloy Bonding Wir
  • Copper Bonding Wire
  • Aluminum Bonding Wire for Power Devices
  • Aluminum Bonding Ribbon
  • Aluminum-Silicon Bonding Wire
  • Silver Alloy Bonding Wire

 

Short Loop ApplicationShort Loop Application Long Loop ApplicationShort Loop Application
Multi-wire bondingMulti-wire bonding

 

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