Solder Paste 75g Sn95.5Ag3.8Cu0.7 Syringe

No-clean solder paste suitable for stencil printing for reflow processes. Minimal residues, excellent activity.

This item is shipped directly from the manufacturer and therefore is not eligible for free delivery.

Key Features:

• Meets J-std and IPC specifications
• Long stencil life
• Long abandon time
• Excellent tack life
• Can be reflowed in air or nitrogen
• Suitable for fine pitch and micro BGA’s
• Very low solder balling
• Spherical alloy particles
• Totally oxide free
• Accurately controlled granular size
• Particles class 2 (45-75µm) to class 5 (15-32µm)
• Reflow range between 99°C and 300°C
• Lead-free alloys

For more information on delivery options please contact your account manager or sales.
Phone: +44 (0)23 8065 0065 Email: [email protected]