Use a tip with a larger diameter than the pad to achieve maximum aspiration and thermal efficiency.
Place the tip with the component terminal in the hole.
When the solder liquefies, gently rotate the tip so that the component terminal can be lifted off.
Press the vacuum pump button long enough to remove the solder.
After pressing the desoldering key there is a slight delay until the self-contained vacuum pump stops. This makes sure that the vacuum circuit is completely empty. If any solder remains are left on a terminal after desoldering it, resolder it with fresh solder and repeat the desoldering operation.