High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre

£20.00 (exc VAT) (£24.00 inc VAT)

High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre

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High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre

Tanaka is the premier manufacturer of bonding wire to the semiconductor industry. Tanaka offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding.

Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. Tanaka brings quality products at the cutting-edge of semiconductor technology.

  • Gold Bonding Wire
  • Gold Alloy Bonding Wir
  • Copper Bonding Wire
  • Aluminum Bonding Wire for Power Devices
  • Aluminum Bonding Ribbon
  • Aluminum-Silicon Bonding Wire
  • Silver Alloy Bonding Wire

 

Short Loop ApplicationShort Loop Application Long Loop ApplicationShort Loop Application
Multi-wire bondingMulti-wire bonding

 

General Specifications

High Reliability

2N Gold Bonding Wire

99% Au-1% Pd

Diameter 4"

Spool 1000 Metre

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