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Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool Tanaka Aluminum Ribbon Flat TABR Series Al Bonding Wire Tanaka Call for price
Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool Tanaka Aluminum TABN Series Al-1% Si Bonding Wire Tanaka Call for price
High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre Tanaka Bare Copper CFB-1 Series Cu Bonding Wire Tanaka Call for price
Tanaka Bonding Wires Precious Metals Tanaka Bonding Wires Precious Metals Tanaka Call for price
High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre Tanaka Copper Alloy CA-1 Series Cu Bonding Wire Tanaka Call for price
High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre Tanaka Gold AuR Series Au 4N Ribbon Flat Bonding Wire Tanaka Call for price
High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre Tanaka Gold GBC Series Au 2N Bonding Wire Bumping Wire Tanaka Call for price
High Reliability 2N Gold Bonding Wire 99% Au-1% Pd Diameter 4"Spool 1000 Metre Tanaka Gold GBE Series Au 4N Bonding Wire Bumping Wire Tanaka Call for price
Tanaka Gold GLD-H Series Au 4N Bonding Wire High Performance Wedge Tanaka Gold GLD-H Series Au 4N Bonding Wire High Performance Wedge Tanaka Call for price
Aluminum 1%-Si Bonding Wire 25um Diameter 1/2" Tanaka Bonding Wires spool Tanaka Gold GLF Series Au 4N Bonding Wire Super Low Loop Tanaka Call for price
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Tanaka Bonding Wire

TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TANAKA offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding. Also high performance flat Gold and flat Al ribbon for RF modules and power applications. Also available Pt Alloy Wire.

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Bonding Wires by Tanaka Precious Metals– Relaying electrical connection technology –

TANAKA provides high performance, high quality bonding wires recognized throughout the world.

Bonding wires are used to electrically connect aluminum electrodes (the connection terminals on IC chips such as LSIs and transistors) with lead electrodes for external connections. Bonding wire products are included in most semiconductor devices used on earth.

As a result of semiconductor devices becoming smaller, wire diameters are becoming thinner as well. Currently, the diameter of mainstream bonding wires is in the range of 15 to 25 µm, which is one-third that of human hair, for which diameters range from 70 to 100 µm.