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Bonding Wires by Tanaka Precious Metals– Relaying electrical connection technology –

TANAKA provides high performance, high quality bonding wires recognized throughout the world.

Bonding wires are used to electrically connect aluminum electrodes (the connection terminals on IC chips such as LSIs and transistors) with lead electrodes for external connections. Bonding wire products are included in most semiconductor devices used on earth.

As a result of semiconductor devices becoming smaller, wire diameters are becoming thinner as well. Currently, the diameter of mainstream bonding wires is in the range of 15 to 25 µm, which is one-third that of human hair, for which diameters range from 70 to 100 µm.