TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TANAKA offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding. Also high performance flat Gold and flat Al ribbon for RF modules and power applications. Also available Pt Alloy Wire.
TANAKA provides high performance, high quality bonding wires recognized throughout the world.
Bonding wires are used to electrically connect aluminum electrodes (the connection terminals on IC chips such as LSIs and transistors) with lead electrodes for external connections. Bonding wire products are included in most semiconductor devices used on earth.
As a result of semiconductor devices becoming smaller, wire diameters are becoming thinner as well. Currently, the diameter of mainstream bonding wires is in the range of 15 to 25 µm, which is one-third that of human hair, for which diameters range from 70 to 100 µm.
