Discontinued
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C-Turn Hot Bar Bonding System
Product Information:
The C-Turn Desktop Series is a product range for Heat-Seal Bonding, ACF Laminating process applications and Reflow Soldering. All kind LCD, Flex foil and PCB connections can be made using these systems. Kaisertech's bonding range has the most intelligent systems designs, very rigid base constructions with exchangeable soldering/bonding heads which minimizes your production down time when switching over to another soldering/bonding head. But more revolutionary are the exchangeable product movement modules They make it possible for you to upgrade your C-Prime to a C-Slide or C-Turn in minutes. You don't need to buy a complete new desktop, only a product movement module which will be a considerable cost benefit for you. C-Turn handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm.
Features
The C-Turn Desktop Series is a product range for Heat-Seal Bonding, ACF Laminating process applications and Reflow Soldering. All kind LCD, Flex foil and PCB connections can be made using these systems. Kaisertech's bonding range has the most intelligent systems designs, very rigid base constructions with exchangeable soldering/bonding heads which minimizes your production down time when switching over to another soldering/bonding head. But more revolutionary are the exchangeable product movement modules They make it possible for you to upgrade your C-Prime to a C-Slide or C-Turn in minutes. You don't need to buy a complete new desktop, only a product movement module which will be a considerable cost benefit for you. C-Turn handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm.
Features
- Most stiff frame construction
- Smartest Hot Bar exchange design
- Exchangeable product handling and process modules
- Controller for time, temperature, force and joint penetration
- User friendly touchscreen
- Soldering/Bonding Head Modules in different force ranges for optimal process adjustment
- Interposer Module for soldering and bonding processes
- Product Alignment for fine pitch applications
- Quality control modules, e.g. automatic force control, joint penetration depth measurement, multiple thermocouples
- Heat-Seal Bonding
- ACF Laminating
- Reflow Soldering
- LCD, Flex foil and PCB connections