Solder paste 75g Sn95.5Ag3.8Cu0.7 syringe

Solder paste 75g Sn95.5Ag3.8Cu0.7 syringe

Product Information:
  • Minimal residues, excellent activity
  • Meets J-std and IPC specifications
  • Long stencil life
  • Long abandon time
  • Excellent tack life
  • Can be reflowed in air or nitrogen
  • Suitable for fine pitch and micro BGA’s
  • Very low solder balling
  • Spherical alloy particles
  • Totally oxide free
  • Accurately controlled granular size
  • Particles class 2 (45-75µm) to class 5 (15-32µm)
  • Reflow range between 99°C and 300°C
  • Lead free alloys
  • Other alloys, flux types and diameters also available

Please contact sales office for prices
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Phone:+44 (0)23 8065 0065
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Phone: +44 02380 650065

Minimal residues, excellent activity

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  • International Delivery


    International DHL delivery available.

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