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Ball & Bump Solder Practice Boards

Ball & Bump Soldering Exercise Boards

 

Browse our range of Practice Ball & Bump Soldering Kits, with many different ranges available. Click to see the components that come included with the kits.

Range Of Ball & Bump Practice Kits & Components Included

Board Description: Low-cost, entry-level kit for practising with a wide range of components. 24 easily identifiable components provided in the kit.

Board Description: Designed with thermal relief inner layers, making this a challenging board to solder. Available in 4 lead free finished.

Board Description: Room for over 200 different components, giving you the choice of where to place & insert. Available for machine or manual insertion.

Board Description: Room for over 200 different components, giving you the choice of where to place & insert. Available for machine or manual insertion.

Board Description: Room for over 200 different components, giving you the choice of where to place & insert. Available for machine or manual insertion.

Board Description: Includes a wide array of legacy through hole and SMT components. This includes flat packs and terminals.

What Are Ball & Bump Solder Kits?

Also referred to as solder balls or solder bumps, these kits involve balls of solder that provide a contact point between the chip package and the PCB.

The solder balls can be placed manually or through automated equipment, held in place by a flux. The packages that are generally associated with ball and bump kits are ball grid arrays, chip-scale packages, and flip chip packages.


How To Order Ball & Bump Soldering Boards With Kaisertech:

Ordering through Kaisertech is simple. Once you know the Ball & Bump practice board that you require, and the volume, contact our team. 

We can provide a competitive and accurate quote, along with a lead time to help make your purchasing decision easier. Call us on 023 8065 0065 or email us today at [email protected]for any further questions you have.

More Information
General Specifications

Standard Board Specs

Board Size 5.5" x 4" (140 x 100mm)
Layers Double Sided (Check Board Specs)
Board Material FR-4
Metallisation 1 Ounce Copper
Solder Mask LPI (Liquid Photo Imageable)
Silk Screen Yes
Tin-Lead Plating HASL (Hot Air Solder Levelling) SnPb
Pb-Free RoHS Tin, Gold (ENIG), Immersion Silver & OSP
Tooling Holes .125" (3.18mm) 4 places
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Ball & Bump Solder Practice Boards

SKU
920-BALL-BUMP

Phone: +44 02380 650065

Ball & Bump Solder Practice Boards


  • UK Delivery

    Free*/£9.50

    *FREE delivery on orders over £50.

  • International Delivery

    International DHL delivery available.

  • Returns

    For more information on returns Click here.

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